3D MEMS - A state of the art technology for the future

Three-dimensional Micro-Electro-Mechanical-Systems, or 3D MEMS, is an innovative combination of technologies for shaping silicon into three-dimensional structures, encapsulation, and contacting for easy mounting and assembly - offering excellent sensor accuracy, small unit size, and low power consumption. An advanced sensor can be fabricated in a tiny piece of silicon, capable of measuring acceleration in three orthogonal directions.

Using our 3D MEMS technology, we at VTI can produce optimised structures for accurate inclination angle sensors, for example, to provide mechanical damping in acceleration sensors for use in environments subject to strong vibration, and high-resolution altimeters. The power requirements of these sensors are extremely low, which gives them a significant advantage in battery-operated devices.

When used to produce inclinometers, VTI's 3D MEMS technology offers
accuracy levels of better than 1 arc minute, compatible with the highest levelling requirements and outperforming all other MEMS technologies. This is combined with average power consumption in the microampere range, ideal for wireless applications.