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Heat Sink Application with I-Scan of Tekscan

http://www.intl-sensor.com    Time:2010/6/9 14:05:40    Count : 2946 Times

Heat Sink Application with I-Scan

High density, active, electronics emit energy that can raise their temperature leading to failures. Heat sinks are secured to components to dissipate their heat. For the heat sink to function properly, even contact must be achieved between the part being cooled and the heat source. This can be difficult to achieve due to the mechanically 搒tiff?nature of the heat sink and hard surfaces involved; where contact may be achieved well at one or two points, but larger regions of potential contact have gaps.

The I-Scan抯 patented, paper-thin sensors can easily be inserted between these two mating surfaces to evaluate and improve the contact. With the help of Tekscan抯 highly qualified sales and engineering support team, each system may be configured to meet your specific needs.

 Tactile Sensor and Electronics
Tactile Sensor Between 2 Components

Heat Sink Pressure Output Above: 2D pressure display of a heat sink. Higher pressures are evident along the right corner, indicating that the contact area between the heat sink and heat source is not uniform.

Applications

  • Design verification testing
  • Reliability improvements
  • R&D for new designs

Benefits

  • Improve design
  • Minimize validation testing time
  • Reduce failures
Typical sensors used in this application
Visit our Sensor Catalog to browse our sensors.
Model #
 Sensing Area
Spatial Density
5027
 		 1.10 x 1.10 in (27.9 x 27.9 mm)
 		 1600.0/in2 (248.0/cm2)
 
5040
 		 1.76 x 1.76 in (44.7 x 44.7 mm)
 		 625.0/in2 (96.9/cm2)
 
5051
 		 2.2 x 2.2 in (55.9 x 55.9 mm)
 		 400.0/in2 (62.0/cm2)
 

 

For further information, refer to the I-Scan?/sup> system


 

 

To Request More Information or a Demonstration- click here
Contact

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Fax：86 010-67124125
http://www.intl-sensor.com
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KeyWord:
Tekscan
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